Master Bond Inc.
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Adhesives for Electronic Applications
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From thermal conductivity to electrical insulation to high temperature resistance and more, Master Bond offers a full line of specialty compounds to meet the rigorous needs of the electronic industry.
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Potting & Encapsulation
Potting & Encapsulation
Offer protection against corrosion and crack resistant
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Die Attach Epoxies
DIE ATTACH Compounds
Feature die shear strength ranging from 20-42 kg-f
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Spin Coating UV Systems
Spin Coating UV Systems
Ideal for high precision optical component manufacturing
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Underfill Compounds
Underfill Compounds
Reduce stress on solder joints and protect from moisture
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Glob Top Formulations
Glob Top Formulations
Offer resistance to moisture, chemicals and contaminants
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Heat Sink Adhesives
Heat Sink Adhesives
Feature high thermal conductivity for heat dissipation
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Master Bond Inc. | www.masterbond.com | newsletters@masterbond.com | +1.201.343.8983
154 Hobart Street, Hackensack, New Jersey 07601 USA

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