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| Low Temperature Heat Curing Adhesive Systems |
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| Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements. |
Low temperature heat curing systems are ideal for:
- Bonding similar/dissimilar substrates with CTE differences
- Minimizing thermal stress
- Preventing warpage, cracking during temperature fluctuations
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| Top Performing Low Temperature Heat Curing Compounds |
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| EP21LSCL-2 |
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| Non-yellowing, low viscosity, two component epoxy |
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| UV22DC80-1Med |
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| Medical grade adhesive uses UV light and heat for curing |
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| EP29LPAOHT |
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| Epoxy for large potting applications features low exotherm |
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| EP4TC-80 |
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| High strength epoxy paste can be applied in very thin sections |
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| Supreme 3CCM-85 |
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| Toughened epoxy for glob topping and small encapsulations |
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| EP5G-80 |
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| Graphite filled NASA low outgassing certified epoxy |
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Copyright © 2024 by Master Bond Inc. All Rights Reserved.
This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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