The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. A high resolution version of this image and files with the body text of this release in Word, HTML and text formats are available at https://www.masterbond.com/newsrelease/ep4en-80. ----------------------------------------------------------------- FOR IMMEDIATE RELEASE One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing EP4EN-80 is suitable not just for bonding, but also for small potting and encapsulations up to about a ¼ inch thick in some applications. Due to its ultra fine particle size filler material this system offers unique gap filling and heat transfer capabilities. It has a thermal conductivity value of 0.75-0.85 W/(m•K) and electrical insulation with a volume resistivity of more than 1014 ohm-cm at room temperature. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns. EP4EN-80 provides notable strength properties including a compressive strength of 24,000-26,000 psi and an ultra high tensile modulus of 1,200,000-1,400,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +150°C. EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It effectively resists waters, oils and fuels. This compound is gray in color and is RoHS compliant. Packaging is available in ½ pint, pint, quart and gallon sizes. Master Bond Thermally Conductive Epoxies Master Bond EP4EN-80 is a one part, non-premixed and frozen epoxy system used for bonding and small encapsulation applications. This electrically insulative system features an ultra fine particle size filler material contributing to its enhanced thermal resistance properties. It can cure at temperatures as low as 80°C unlike conventional one part, heat curing systems. Read more about Master Bond’s thermally conductive adhesives at https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com. Note to Editors: For a full product description, please visit: https://www.masterbond.com/tds/ep4en-80 Check out new videos on our YouTube channel: https://www.youtube.com/user/MasterBondVideo You can embed any of our videos on your website. CONTACT James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: +1-201-343-8983 Fax: +1-201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com # # #