The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. High resolution version of this image and files with the body text of this release in Word, HTML and text formats are available at http://www.masterbond.com/newsrelease/supreme-3htnd-2dm. ----------------------------------------------------------------- FOR IMMEDIATE RELEASE One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two methods to protect chips and their wire bonds. One method is referred to as glob top, where the encapsulating system is dispensed and applied directly to the area to be protected. The dam-and-fill method entails dispensing the damming material around the area to be encapsulated. This material will cure in place and will not run, in essence forming a dam. Then an encapsulating material is applied to cover the remaining area to be protected. This system can be cured in thicknesses up to ¼ inch. Supreme 3HTND-2DM passes ASTM E595 specifications for NASA low outgassing enabling it to be used in vacuum, aerospace, electro-optic and other related applications. This high performance compound bonds well to a wide variety of substrates used in electronics including silicon and other semiconductors, metals, ceramics and many plastics. Most importantly, Supreme 3HTND-2DM has enhanced dimensional stability and has a tensile strength of 6,000-7,500 psi at room temperature. It also maintains its Shore D hardness of 85 after withstanding 1,000 hours at 85°C/85% RH. As a toughened system, Supreme 3HTND-2DM resists rigorous thermal cycling. It is a reliable electrical insulator and features a thermal conductivity of 10-11 BTU•in/ft2•hr•°F [1.44-1.59 W/(m•K)]. This epoxy withstands exposure to water and chemicals such as acids, bases, fuels and a number of common solvents. It is considered to have to have low ionic levels of chlorine, sodium and potassium (less than 10 ppm). This single component system is easy to handle and offers “unlimited” working life at room temperature. It cures readily at 250°F in 20-30 minutes or 5-10 minutes at 300°F. It is serviceable from -100°F to +400°F [-73°C to +204°C]. Supreme 3HTND-2DM is available for use in syringes, cartridges and jars. Master Bond High Temperature Resistant Adhesives Supreme 3HTND-2DM is a toughened, NASA low outgassing, high temperature resistant adhesive for specialty electronic applications. Read more about Master Bond’s heat resistant adhesives at http://www.masterbond.com/properties/high-temperature-resistant-bonding-sealing-and-coating-compounds or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com. Note to Editors: For a full product description, please visit: http://www.masterbond.com/tds/supreme-3htnd-2dm Check out new videos on our YouTube channel: http://www.youtube.com/user/MasterBondVideo You can embed any of our videos on your website. CONTACT James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: +1-201-343-8983 Fax: +1-201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com