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The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication.

Attached to this email is a low resolution version of the photograph that is included in the press kit for this product.

High resolution versions of this image and files with the body text of this release are available at http://www.masterbond.com/mbnr.html?nr=ep21fl.

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FOR IMMEDIATE RELEASE

Low to Moderate Viscosity, Toughened Two Component Epoxy System
for High Performance Casting, Bonding and Sealing

HACKENSACK, NJ – Feb 25, 2010 – Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to +250ºF.

The typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B. This system produces high strength castings, bonds and seals which are remarkably resistant to thermal cycling and shock. Its bond strength is generally greater than 1,500 psi and its tensile strength normally exceeds 1,100 psi.

The hardened compound is an electrical insulator with a volume resistivity greater than 10¹² ohm-cm. As a flexibilized system, it is characterized by superior impact and chemical resistance.

EP21FL is available in half pint, pint, quart, one gallon and five gallon container kits.

CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com

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