Master Bond offers a variety of thermally conductive epoxies for potting and encapsulation applications. These compositions offer good flow properties and feature thermal conductivity as well as outstanding electrical insulation properties. Conventional fillers consist of aluminum oxide and aluminum nitride with different particle size distributions. Master Bond potting/encapsulation systems are solvent-free, and many provide a long pot life combined with a lower exotherm during the curing process. They are also engineered to reduce shrinkage and to lower the stress on the components. They have been successfully employed to prevent excessive heat build-up even in complex assemblies.
Different Master Bond grades have been developed to fulfill an abundant assortment of customer specifications. They offer resistance to:
- Humidity
- Salt spray
- Flame, smoke, and toxicity
- Abrasion
- Shock, vibration, and impact
- Extreme temperatures, including cryogenic conditions
- Thermal cycling
Specialty systems have been designed to pass:
- NASA low outgassing requirements,
- USP Class VI biocompatibility certifications,
- ISO10993-5 tests for non-cytotoxicity,
- MIL Std 810G for fungus resistance, and
- FAR 25.853 vertical burn tests.
These compounds are able to protect fragile electronic components, offer excellent dimensional stability, and possess high mechanical strength. Special compounds offer low coefficient of thermal expansion combined with high glass transition temperatures. Additionally, Master Bond produces compositions that are available in different colors, mix ratios, viscosities, cure speeds etc. suitable for large production runs with automatic dispensers. Small quantities can also be purchased in convenient, easy to use packaging and are recommended to maximize productivity, eliminate waste and to ensure consistent reproducible results.
They are capable of being employed for manufacturing:
- Power supplies
- Transformers
- Motors
- Capacitors
- Vehicle batteries and chargers
- LCDs
- PCBs
- Relays
- Resistors
- Coils
- Solar panels
- Junction boxes
As electronic designs become more compact and deliver more power, efficiency becomes abundantly more important. Master Bond is actively playing a crucial role in achieving improved capabilities for our thermally conductive compounds to accomplish these vital goals.
