UV23FLDC-80TK Product Information

One Part, Dual Curing Adhesive UV23FLDC-80TK

One component, moderate viscosity, dual curing, cationic type system. Good flexibility. Serviceable from -80°F to 300°F.

EP62-1HTMed Black Product Information

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity

EP4G-80 Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

MasterSil 323Med Product Information

Two Component, medical grade silicone for bonding, sealing and encapsulating. Featuring ISO 10993-5 and excellent strength properties.

MasterSil 323AO-LO Product Information

Two part silicone for high performance casting, potting & encapsulation and sealing

Supreme 11ANHT-2 Product Information

Supreme 11ANHT-2 Two Part Epoxy

Two component, thermally conductive, electrically insulating epoxy for bonding, coating and sealing featuring small particle size filler

EP22ND Product Information

Aluminum Filled, Tough, Two Component Epoxy Adhesive for High Performance Bonding, Sealing and Coating with Enhanced Machinability and High Compressive Strength.

EP21LVFL Product Information

Two Component, Low Viscosity Epoxy System For Bonding, Sealing, Coating, Encapsulation. High elongation, low modulus.

EP21AOLV Product Information

EP21AOLV Two Component Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

Supreme 11HTND Product Information

Supreme 11HTND Two Component Epoxy System

Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength

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