EP39-2 Product Information

EP39-2 Two Part Epoxy

Low Viscosity, Fast Curing, Two Component, High Performance Optical Epoxy for Bonding, Sealing, Coating and Casting Featuring Excellent Chemical Resistance.

EP39-2LV Product Description

EP39-2LV Two Component Epoxy

Low Viscosity, Fast Curing, Two High Performance Optical Epoxy For Bonding, Sealing, Coating & Casting Featuring Excellent Chemical Resistance

EP39-M Product Description

Two Component, Low Viscosity Epoxy Adhesive/Sealant For High Performance Bonding Featuring Excellent Electrical Insulation Characteristics, High Thermal Stability and Superior Chemical Resistance.

EP39MHT Product Information

EP39MHT Two Part Epoxy System

Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F

EP3ANHT Product Description

EP3ANHT One Part Epoxy

One Component Abrasion, Thermal Shock and Heat Resistant Thermally Conductive Epoxy for Electrical Potting Encapsulation and Bonding

EP3AOHT Product Description

EP3AOHT One Part Epoxy

One Component Abrasion, Thermal Shock and Heat Resistant Thermally Conductive Epoxy for Electrical Potting Encapsulation and Bonding

EP3AOHTLV Product Description

EP3AOHTLV One Component Epoxy

One Component Abrasion, Thermal Shock, and Heat Resistant Thermally Conductive Epoxy for Electrical Potting, Encapsulation and Bonding

EP3FL Product Information

EP3FL One Part Epoxy Compound

One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.

EP3HT Product Information

EP3HT One Part Epoxy

One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties.

EP3HTFL Product Information

EP3HTFL One Part Epoxy

One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications

Pages