Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F. Meets NASA low outgassing specifications.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Well Suited for Resisting a Wide Variety of Chemicals at Higher Temperatures.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Excellent Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability Along With Exceptional Electrical Insulation Properties.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Superlative Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
