EP30QF Product Information

EP30QF Two Part Epoxy Compound

Quartz Filled, Two Component Epoxy System for High Performance Bonding, Sealing, Coating & Casting, Featuring Exceptionally Low Shrinkage and High Dimensional Stability.

EP31 Product Information

EP31 Two Component Epoxy System

Two Component, Room Temperature Curing Epoxy Adhesive for Structural Bonding Featuring Extraordinarily High Shear & Peel Strengths

EP31T Product Description

EP31T Two Part Epoxy

Two Component, Room Temperature Curing Epoxy Adhesive For Structural Bonding Featuring Extraordinarily High Shear & Peel Strengths

EP33 Product Information

Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.

EP33LV Product Information

EP33LV Two Part Epoxy

Two Component, Lower Viscosity Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.

EP33ND Product Information

EP33ND Two Part Epoxy

Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.

EP34 Product Information

EP34 Two Component Epoxy

Two Component, Room Temperature Curing Epoxy System For High Temperature Potting & Encapsulation Applications

EP34AN Product Description

EP34AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Exceptionally High Thermal Conductivity.

EP34AO Product Description

EP34AO Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Excellent Thermal Conductivity.

EP34CA Product Information

EP34CA Two Part Epoxy

Two Component Epoxy Resin System for High Pertormance Applications

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