One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity
One Component, Thermally Conductive, Electrically Insulating Epoxy Featuring Excellent Bonding and Physical Strength Properties, Along with a Superior Ability to Withstand Thermal Cycling. Cryogenically Serviceable. Requires Oven Curing.
One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Meets NASA Low Outgassing Specifications.
One Component, Toughened Epoxy Adhesive/Sealant Offers Highly Desirable Combination of Properties Including High Peel and Shear Strengths, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Features Good Flow Properties. NASA low outgassing approved.
