Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +250°F Featuring High Peel and High Shear Strength
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.
Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical Resistance is NASA low outgassing approved.
Two Component, Flexible, Low Viscosity Epoxy Compound Meets ISO 10993-5 certification. Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Excellent Adhesion To Engineering Plastics And Metals, Polycarbonates And Acrylics
