Thermal Cycling Resistant

Supreme 3HTLV Product Information

Supreme 3HTLV One Part Epoxy Adhesive System

One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.

EP21TDCN-LO Product Information

EP21TDCN-LO Two Part Epoxy System

Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity

EP3UF Product Information

EP3UF One Part Epoxy Adhesive System

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

EP3HTS-LO Product Information

One Component Epoxy Compound

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

X5G Product Information

X5G One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5N Product Information

X-5N One Part Elastomeric Compound

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5SC Product Information

X5SC One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

Supreme 45HTQ-4 Product Information

Supreme 45HTQ Two Component Epoxy

Two component epoxy system for bonding, sealing and casting

EP30-2LB Product Information

EP30-2LB Two Part Epoxy System

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity. Meets NASA Low Outgassing Specifications.

EP21NDCL Product Information

EP21NDCL Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

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