Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.