Master Bond Supreme 10HTFL, an epoxy that features good toughness, combines convenient processing and a superior physical strength profile. From the handling perspective, Supreme 10HTFL is a true one part system. It is not premixed and frozen and has unlimited working life at room temperature. It is relatively faster curing with typical cure schedules of 20-30 minutes at 300°F or 45-60 minutes at 250°F. Post curing for 1-2 hours at 250-300°F will help to optimize the properties. It is a smooth high viscosity system that flows well. Supreme 10HTFL has an attractive array of advantageous physical strength and electrical insulation properties. Most importantly, it is a forgiving epoxy, that is to say, it is less rigid than typical high temperature resistant epoxies. This “toughness” gives Supreme 10HTFL superior resistance to impact, thermal and mechanical shock and vibration, and allows it to be used in applications with rigorous thermal cycling. The system is a good option when bonding substrates with different coefficients of thermal expansion. In this context, it should be noted that it bonds well to a wide variety of substrates including metals, glass, composites, ceramics, rubber and many plastics.
An additional feature of Supreme 10HTFL is its wide temperature range of 4K to +350°F. It is 100% reactive and does not contain any solvents or diluents. It has good chemical resistance to water, oils, fuels and many cleaning agents. As mentioned before, the epoxy has excellent electrical insulation properties (see chart below). Its natural color is gray, but other colors are available. Also, it can be formulated as a non-flowing paste with the same properties and with the part number Supreme 10HTFLND-2. Supreme 10HTFL should be considered a viable option for challenging applications in the aerospace, electronic, optical, opto-electronic, specialty OEM and related industries.
Product Advantages
- One component system, not premixed and frozen
- Convenient storage at room temperature or refrigerated; freezing not needed nor recommended
- Versatile curing at 250-300°F
- Outstanding toughness, highly resistant to aggressive thermal cycling
- Impressive electrical insulation properties
- Good dimensional stability and low shrinkage upon curing
