Solvent for removing and deflashing cured epoxy resins
Key Features
- Low volatility
- High boiling point
- Low surface tension
- Highly effective for removing cured epoxy
Product Description
Master Bond MB6A is a remarkably effective solvent composition for deflashing and removing cured epoxy resin compounds. It initiates and promotes disintegration by flaking and breaking rather than pure solvent action. Master Bond MB6A is most effective when used hot. It does not discolor or attack metals or platings commonly employed in electronic assemblies. Master Bond MB6A is completely miscible with water.
Industrial Certifications
Packaging
MB6A is available is various sizes and units to accommodate customer's needs.