Two component, room temperature curing epoxy for bonding, sealing and coating
Key Features
- Superlative thermal conductivity
- Exceptional electrical insulation properties
- Temperature resistance up to +450°F
- Outstanding thermal cycling capabilities
Product Description
Master Bond EP34AN-1 is a two part, room temperature curing epoxy system for bonding, sealing and coating featuring high temperature resistance, sterling thermal cycling capabilities, first rate thermal conductivity and peerless electrical insulation properties. It is very easy to work with as it has a 100 to 70 mix ratio by weight which works out to a very convenient one to one ratio by volume. This system cures readily at room temperature or more rapidly at elevated temperatures. To optimize its properties, the recommended cure schedule is overnight at room temperature followed by a post cure at 150-200°F for 2-3 hours. Upon polymerization EP34AN-1 is serviceable from -60°F to +450°F. Another noteworthy characteristic is its superior dimensional stability. It resists a range of chemicals including water, oils, fuels and many acids and bases. This thixotropic system bonds well to a wide variety of substrates including metal, composites, glass, ceramics and many rubbers and plastics. As previously mentioned, EP34AN-1 combines thermal conductivity, electrical insulation, the ability to withstand rigorous thermal cycling and an array of superior physical strength properties. EP34AN-1 is 100% reactive and does not contain any diluents or solvents. The color of Part A is gray, Part B is gray. It is widely used in aerospace, electronic, electrical and specialty OEM type applications among others where the combination of properties mentioned above is desirable.
Product Advantages
- Convenient mixing: one to one ratio by volume
- Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
- High temperature resistance up to 450°F
- Combines exceptionally high thermal conductivity and fine electrical insulation properties
- Very good dimensional stability
- Capable of withstanding rigorous thermal cycling
- Superb adhesion to a wide variety of substrates
- Convenient mixing: one to one ratio by volume
- Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly
- High temperature resistance up to 450°F
- Combines exceptionally high thermal conductivity and fine electrical insulation properties
- Very good dimensional stability
- Capable of withstanding rigorous thermal cycling
- Superb adhesion to a wide variety of substrates
Packaging
EP34AN-1 is available is various sizes and units to accommodate customer's needs.