Advanced compositions feature high bond strength, speedy processing and are engineered to join surfaces with dissimilar coefficients of expansion.
This infographic features one part systems that are easy to handle, have unlimited working lives and cure rapidly at 200°F or less. This allows these products to be used for applications involving heat sensitive substrates.
Master Bond Products Covered in this Infographic
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EP17HT-100 High performance one part epoxy. Good flow properties. Thermally conductive, electrically insulative. Service temperature range -100°F to +500°F. Can be cast in thicknesses up to 1/2 inch. High dimensional stability. |
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Supreme 3HT-80 Fast cures at ambient 175°F (80°C). Recommended for bonding heat sensitive substrates. Outstanding thermal cycling capabilities. Single part no mix system. Serviceable from -100°F to +350°F. Tough and durable. Withstands 1,000 hours at 85°C/85% RH. |
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EP3RR-80 Moderate viscosity with excellent flow properties. One part system featuring cures at 80°C or higher. Superior thermal conductor. Excellent electrical insulator. Low exotherm while curing. Outstanding mechanical strength properties. Withstands 1,000 hours 85°C/85% RH. Passes NASA low outgassing tests. Serviceable from -100°F to +350°F. |
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UV22DC80-1 Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F. |