One component, black epoxy for bonding, sealing and specialty dam-and-fill applications
Key Features
- High temperature resistant
- Good physical strength properties
- Not premixed and frozen
- Convenient packaging and dispensing
Product Description
Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip, one part epoxy for bonding, sealing and dam-and-fill applications. When used in electronics, perhaps its main use is for chip on board encapsulation.The epoxy is used as a damming or blocking system. That is to say, it blocks the flow of another epoxy that is encapsulating chips and wire bonds. EP17HTDM-2 Black requires no mixing and cures readily at elevated temperatures. One cure schedule is 4-6 hours at 300°F, and a second is 2-3 hours at 350°F. It is not premixed and frozen and its working life at room temperature is unlimited. It has very low shrinkage upon curing.
This epoxy bonds well to a wide variety of substrates including metals, composites, ceramics and many plastics. It provides excellent thermal conductivity while retaining superior electrical insulation values. It offers very good epoxy type chemical resistance to fuels, oils, water, acids, bases and solvents. The service temperature ranges from -80°F to +600°F. Its color is black but other options are available. EP17HTDM-2 Black passes the NASA low outgassing test. These product properties are attractive for specialty applications in aerospace, electronic, OEM and other related industries. However its main function is in electronics as a dam-and-fill epoxy. Additionally, it fits nicely as a barrier material in electronic and semiconductor applications.
Product Advantages
- Single component system, no mixing prior to use
- High temperature resistance
- Electrically insulative, even at high temperatures
- No flow, ideal for dam-and-fill
- Good thermal conductivity
- NASA low outgassing
Industrial Certifications
Packaging
EP17HTDM-2 Black is available is various sizes and units to accommodate customer's needs.
