Master Bond EP21TDCN was used by researchers at Università di Firenze, Italy, to create a rigid structure for sensor arrays by bonding PVDF film between two PCBs in their study of the laser pulse detection capabilities of pyroelectric sensors. For this application, the researchers required a conductive bonding compound able to form reliable electrical connections between the film’s gold pads and the PCB’s copper pads. A further requirement for the bonding compound related directly to the fabrication process. In this case, the researchers used a programmable robot designed to dispense the bonding agent, requiring a compound with consistent viscosity to ensure a uniform flow in building the assembly.1
The research team found that Master Bond EP21TDCN epoxy met both performance and manufacturing requirements.
Sources:
1Capineri, L. & Mazzoni, Marina. (2010). Laser Pulses Characterization with Pyroelectric Sensors. Laser Pulse Phenom. Appl. doi:10.5772/13292.
https://library.oapen.org/handle/20.500.12657/32327. Accessed September 2023.