Expanded Product List
Master Bond Product Search
355 products match
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EP37-3LV Clear, two component epoxy system has long pot life. Convenient one to one mix ratio. High bond strength. Superb chemical resistance properties. Used in bonding, sealing, potting and filament winding applications. Low viscosity compound. Exceptionally low exotherm. Cures rigid. Service operating temperature range from -60°F to +250°F. |
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EP38 Electrically insulative compound. Excellent flowability. High flexibility. Superior tensile and compressive strength. Cures quickly. Outstanding optical clarity. Protect against boiling water. Short tack free time. Low shrinkage upon cure. Easy to apply by roller, brush, spray equipment. Serviceable from -60°F to +250°F. |
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EP38CL Two component, low viscosity, optically clear epoxy adhesive, coating, sealant, encapsulant. Superior toughness and durability. Possesses extraordinary impact resistance. Protects against thermal cycling. Withstands 1,000 hours 85°C/85% RH. Service temperature range is -100°F to +250°F. |
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EP38FLAO Highly flexible. Thermally conductive/electrically insulative. Excellent flowability. Well suited for potting and encapsulation. Withstands rigorous thermal cycling and shocks. Low exotherm. Long working life. One to one mix ratio by weight or volume. Serviceable from -100°F to +250°F. |
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EP39-2 Low viscosity, two component epoxy system. Superior light transmission properties. Rigid curing. Short tack-free time. Can be applied by roller, brush or conventional spraying equipment. Superior chemical resistance. Serviceable from -60°F to +300°F. Successfully tested for 1,000 hours 85°C/85% RH. Guards against wear. |
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EP39-2LV Fast curing, chemical resistant epoxy system. Convenient two to one mix ratio by weight. Superior protection against wear. 100% reactive. Optically clear. Easy application by brush, roller, spray equipment. Cures rigid. Ideal for polishing. Service temperature range -60°F to +300°F. |
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EP39-M Two part epoxy adhesive/sealant featuring excellent electrical insulation properties. Thermal stability. Superior chemical resistance. Guards against thermal cycling. Adheres well to similar/dissimilar substrates. Low viscosity. Serviceable from -60°F to +350°F. |
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EP39MAOHT Thermally conductive, low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Service temperature range -100°F to +400°F. |
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EP39MHT Low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Successfully tested for 1,000 hours 85°C/85% RH. Service temperature range -100°F to +400°F. |
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EP40 Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F. |