Low Viscosity, Fast Curing Two Component Epoxy Compound For High Performance Casting And Bonding
Low Viscosity, Fast Curing Two Component Epoxy Compound For High Performance Casting And Bonding
Master Bond Polymer System EP28M is a remarkably fast curing, low viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive and does not contain any diluents, solvents or other volatiles. Master Bond Polymer System EP28M is readily prepared for use by mixing the two components with a convenient two (2) to one (1) ratio by weight. Cure is exceptionally fast even at low temperatures and high relative humidities. Thin (6 mil) films become tack free at ambient temperatures in only 3 hours. The ready cure characteristics coupled with unique resistance to blushing and exudation, high toughness and superior wear resistance make EP28M particularly attractive for applications where new castings must be put into service within a matter of hours and then perform well over long periods of service.
Master Bond Polymer System EP28M has proven ideally suited for Industrial as well as institutional and commercial casting applications particularly in applications requiring durability, chemical resistance, easy low cost maintenance and a high degree of dimensional stability. It is highly recommended for casting and bonding in the electronic, electrical, electromechanical, computer, optical and related industries.
