EP3AOHT Product Description

Master Bond Polymer System EP3AOHT is a new superior and cost effective epoxy resin system for electrical potting, encapsulation, and bonding. It combines high physical strength, including resistance to abrasion, thermal shock and heat. It has good thermal conductivity, is inert to water and chemicals, with good electrical insulation characteristics. It has a service temperature range from - 60°F up to 400°F. Adhesion to both metallic and nonmetallic substrates is excellent. Master Bond Polymer System EP3AOHT offers the application convenience of a one component epoxy system which eliminates mixing and provides flexible cure schedules to best meet specific application requirements. It is 100% reactive and does not contain any solvents or diluents.

Master Bond Polymer System EP3AOHT is supplied in the form of a light gray paste having a minimum storage stability of more than 3 months when stored at room temperature. Refrigeration greatly extends the storage stability of this epoxy to 6 months. Gel time and cure schedules depend on temperature. The gel time at 150°C is in the order of 90-100 seconds. The recommended cure time at 150°C is in the order of 10-15 minutes and at 125°C in the order of 20-25 minutes.