Master Bond EP5TC-80 is a one component, flowable paste epoxy for bonding, sealing and small encapsulation applications. EP5TC-80 is a special system. A typical, unfilled epoxy is highly electrically and thermally insulative (with a thermal conductivity value of about 0.25 W/(m•K)). Adding filler materials that conduct heat and not electricity, generally increases thermal conductivity (maybe up to 1-2 W/(m•K)). EP5TC-80 is able to achieve up to 3.3-3.7 W/(m•K). It is shipped at -40°C and should be stored at that temperature. Once removed from the freezer, to obtain the best properties, the material should be used within 12 hours. Any leftover material should be discarded.
This system bonds well to a wide variety of substrates such as metals, composites, ceramics and many plastics. It has particularly noteworthy tensile modulus and compressive strength. The filler material has ultra fine particles, with the largest being 20-25 microns, which allows it to be applied in very thin sections. The end result is very low thermal resistance. The combination of fine bond lines and thermal conductivity lowers the thermal resistance to 6-10 x 10-6 K•m2/W. Curing is simple and straightforward, 80°C for 90-120 minutes with an optional post cure of 1-2 hours at 80°C to optimize properties.
EP5TC-80 resists water, oils and fuels. It is gray in color. The service temperature range is -50°C to +150°C. With its robust thermal conductivity, it can solve thermal management issues in aerospace, electronic, opto-electronic, and specialty OEM applications. EP5TC-80 is a versatile system which can be used for bonding heat sinks to circuit boards, coils and motors, die attaching in optics, bonding SMDs, potting power modules and encapsulation of very small coils.
Product Advantages
- Single component, no mixing needed
- Flowable, can cure up to 1/4 inch thick
- Low shrinkage
- Highly dimensional stability
- Passes NASA low outgassing
