EP88FL Product Information

Two component, room temperature curing epoxy for bonding, coating, sealing and potting

Key Features

Low viscosity
Moderately fast set up time
Optically clear
High flexibility
Cryogenically serviceable
Resists thermal cycling and shock

Product Description

Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. It features a forgiving one to one mix ratio by weight or volume. It cures readily at room temperature and will cure faster at elevated temperatures. The optimum cure is overnight at room temperature followed by 1 to 2 hours at 150°F to 200°F. The system is 100% reactive and does not contain any solvents or diluents.

EP88FL bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics. Since it is a flexible system, it is well suited for bonding dissimilar substrates. It has very good resistance to rigorous thermal cycling. Additionally it can withstand thermal and mechanical shocks. EP88FL has reasonably good chemical resistance to water, oils, fuels and mild acids and bases. The combination of low viscosity and superb electrical insulation properties makes it a good option for potting and encapsulation.

Its service temperature range extends from 4K to 250°F. The color of both part A and B is clear. EP88FL can be considered in applications involving optics, electronics, aerospace and specialty OEM where the properties discussed here are desirable.