Supreme 3AO Product Description

Master Bond Polymer System Supreme 3AO is a storage stable one component, heat curing epoxy adhesive featuring a hither to unattainable balance of performance properties including both high shear and high peel strength, plus the convenience of a fast cure at low temperatures if desired. This new one component adhesive system is formulated to cure by exposure to a wide range of elevated temperatures, from as low as 220°F (104°C) to 350°F (177°C) and higher, (minimum cure temperature 215-220°F). Tensile shear strengths in excess of 1800psi and T-peel strengths over 20pli are readily obtained. No mixing is necessary prior to use. Supreme 3AO is thermally conductive.

Master Bond Polymer System Supreme 3AO produces remarkable good performance bonds with both high shear and high peel strength for service in the wide temperature range of below -100°F to +300°F. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resin adhesives. Master Bond Polymer System Supreme 3AO can be applied without sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer System Supreme 3AO produces durable high strength and exceptionally tough bonds after only short cures at low temperatures which are remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Unlike many other epoxy adhesives, its performance is relatively insensitive to changes in cure schedules or substrate cleaning procedures. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is a superior electrical insulator. Color is gray.

Master Bond Polymer System Supreme 3AO offers the convenience of fast heat cures at a wide range of temperatures with no mixing prior to use and a uniquely favorable bonding performance for difficult applications in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries, especially where heat sensitive substrates limit permissible temperatures for curing adhesives.