Breaking Through the Walls of Thermal Management

Featuring high thermally conductive fillers, Master Bond EP48TC is a two component epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. It complies with NASA low outgassing specifications and can be used in applications in a variety of high-tech industries.

 

Request a technical data sheet
Request a safety data sheet
Discuss your application

 

Video Transcript

Breaking through the walls of thermal management: Two part epoxy EP48TC featuring ultra low thermal resistance

How is thermal resistance calculated? R=t/K

  • where R equals thermal resistance,
  • t equals thickness and
  • K equals thermal conductivity.

How can you achieve low thermal resistance? By using high thermally conductive fillers that have a small particle size allowing the adhesive to be applied in very thin sections. Master Bond EP48TC can be applied in sections as thin as 10-15 microns and features a thermal conductivity of 2.88-3.60 W/(m•K) at 75°F. Master Bond EP48TC has unsurpassed thermal resistance of 5-7 x 10-6 K•m2/W at room temperature.

Can a thin bond line be a strong one? EP48TC offers mechanical strength properties:

  • tensile strength at 75°F is 6,000-7,000 psi
  • tensile modulus at 75°F is 600,000-700,000 psi
  • tensile lap shear strength at 75°F is 900-1,100 psi

    • Other impressive properties include:

    • Very low CTE of 13-15 x-6 in/in/°C
    • NASA low outgassing approved
    • Exceptional dimensional stability

    EP48TC can take thermal management to the next level. Is it right for your application?