One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
One Component, Toughened Epoxy Adhesive, Sealant and Coating Featuring High Shear and High Peel Strengths. Uniquely Special System Cures at 175°F with Superior Adhesive Properties and Outstanding Thermal Cycling Capabilities.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
Two Component Fast Curing Heat Resistant Toughened Epoxy Adhesive Featuring High Shear Strength, Superior Dimensional Stability, Good Chemical Resistance, Excellent Impact and Shock Resistance for Superior Bonding
One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.
One Component, UV Curable System for High Performance Coating, Bonding and Sealing, Featuring Excellent Physical Properties and Dimensional Stability; Exceptionally Low Viscosity; Ideal for Applications Involving Spin Coating.
