Heat Cure

EP21TP-2NV Product Information

Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.

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EP30M3LV-2NV Product Information

Two component epoxy system for potting and encapsulation features low viscosity and superior electrical insulation

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EP30DPBFMed Product Information

EP30DPMed Two Component Epoxy-Urethane Blended System

Meets USP Class VI Specifications for Medical Applications Flexibilized, Two Component , Epoxy-Urethane Blend Used For Bonding, Coating, Sealing and Encapsulation, Featuring Superior Toughness, Repairability, Abrasion Resistance, and Cryogenic Serviceability

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EP21TPND-NV Product Information

EP21TPND-NV Two Component Epoxy Polysulfide

Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing and Coating Offers Exceptional Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils; Paste-Like Consistency.

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UV15DC80-10 Product Information

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

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UV15DC80TK Product Information

UV15DC80TK One Part UV and Heat Curable Epoxy

One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.

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EP126TK Product Information

Two Component Epoxy with High Temperature Resistance For Prolonged 600°F Service With Outstanding Chemical Resistance

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UV22DC80ND Product Information

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.

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UV22DC80TK Product Information

UV22DC80TK One Part, Dual UV and Heat Curing System

One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.