One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
Two Component, Room Temperature Curing Epoxy Resin for Bonding, Coating, Sealing and Potting Offers Outstanding Non-Yellowing Characteristics; Featuring Low Viscosity and High Temperature Resistance
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Light Transmittance.
Two Component, Higher Viscosity Epoxy System for High Performance Bonding and Sealing Featuring Rapid Curing and High Shear and Peel Strengths along with Excellent Toughness.
Low Viscosity, Two Component Epoxy Compound for High Performance Sealing, Casting, Potting and Bonding Featuring Superior Electrical Insulation Properties and Lower Exotherm; Standard Color is Black.
Toughened, Two Component, Room Temperature Curing Epoxy System for Bonding, Coating, Sealing and Encapsulation Featuring Abrasion Resistance and Cryogenic Serviceability.
One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
Two Component, Room Temperature Curing Epoxy Polysulfide for High Performance Bonding, Sealing, Coating and Encapsulation, Offers Excellent Toughness along with Superior Resistance to Chemicals, Particularly to Fuels and Oils.
