Epoxy

EP21LP Product Description

Two Component Clear, Long Pot Life Epoxy Adhesive for High Performance General Purpose Bonding

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EP21LV Product Information

EP21LV Two Component Low Viscosity Epoxy System

Versatile Two Component, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation and Casting.

Conforms to FDA Chapter 1, Section 175.105 for Indirect Food Applications.

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EP21LV3/5Med Product Information

Flexible, Two Component, Low Viscosity Epoxy System for High Performance Bonding, Sealing, Coating, Encapsulation & Casting. Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications. Meets USP Class VI Specifications for Medical Applications.

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EP21ND Product Information

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

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EP21ND-2 Product Information

Two Component Non-Drip Epoxy for High Performance General Purpose Bonding, Sealing, and Coating

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EP21ND-LO Product Information

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Application Feature. Meets NASA Low Outgassing Specifications.

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EP21Q Product Description

Two Component Quartz Filled Epoxy System For High Performance Bonding, Coating and Sealing with Enhanced Corrosion And Abrasion Resistance

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EP21SL5 Product Description

Two Component, High Performance Epoxy Resin System For Bonding Teak And Other Wood Products

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EP21TCHT-1 Product Information

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.