Dimensionally Stable

EP30TC Product Information

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

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One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

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Supreme 45HTQ-4 Product Information

Two component epoxy system for bonding, sealing and casting

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Supreme 34CA Product Information

Two Component Epoxy Resin System for High Pertormance Applications

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EP29LPAO Product Information

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

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EP30-2LB Product Information

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity. Meets NASA Low Outgassing Specifications.

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EP21NDCL Product Information

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

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EP41S-5 Product Information

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.

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Supreme 3HTND-2CCM Product Information

One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.