One Component, Paste Consistency UV Curable Polymer System for High Performance Bonding, Sealing and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
One Component, UV and Heat Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation. Dual Cure System Allows for Curing in “Shadowed Out” Areas.
One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
