High Temperature Resistant

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring Exceptional Thermal Conductivity, Excellent Electrical Insulation Properties and High Temperature Resistance.

Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

Two Component, Toughened Epoxy Compound For High Performance Bonding, Sealing And Casting Featuring High Peel Strength Resistance To Vibration Impact And Shock For Service Up to 400°F.