High Temperature Resistant

EP17HT Product Information

EP17HT One Part Epoxy

One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F.

EP17HT-3 Product Information

EP17HT-3 One Part Snap Curing Epoxy

One Component, Heat Curing Epoxy Featuring "Snap Curing" Along with High Temperature Resistance up to 400°F; Can Cure in Sections up to ¼ Inch Thick.

EP19HT Product Information

EP19HT One Component Epoxy System

One Component, Storage Stable Epoxy Resin System for Durable High Performance Adhesive/Sealants, Impregnants and Liners

EP19HTFL Product Information

EP19HTFL One Part Epoxy

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21ANHT Product Information

EP21ANHT Two Part Epoxy Compound

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring Exceptional Thermal Conductivity, Excellent Electrical Insulation Properties and High Temperature Resistance.

EP21AOHT Product Information

EP21AOHT Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F

EP21AOHTLV Product Description

EP21AOHTLV Two Part Epoxy

Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service

EP21ARHT Product Information

EP21ARHT Two Part Epoxy

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.

EP21HT Product Information

EP21HT Two Part Epoxy System

Two Component, Room Temperature Curing Adhesive, Sealant & Coating Featuring Convenient 1:1 Mix Ratio and High Temperature Serviceability Up To 400°F Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications

EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

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