One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.
Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
One Component Thermal Shock and Heat Resistant Flexibilized Epoxy System For High Performance Electrical Potting, Encapsulation and Bonding Superior for underfill applications
One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties. Meets USP Class VI Specifications.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed
