Thermal Cycling Resistant

Two Component Epoxy Adhesive For High Performance Bonding, Sealing and Encapsulation

Versatile Two Component, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation and Casting.

Conforms to FDA Chapter 1, Section 175.105 for Indirect Food Applications.

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Application Feature. Meets NASA Low Outgassing Specifications.