Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermal Conductivity, Excellent Electrical Insulation Properties and Exceptionally Long Working Life.
Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.
One Component Sodium Silicate, Aqueous Based Silver Conductive Coating System Featuring Awesome Shielding Effectiveness, Temperature Resistance Up To 700°F and Easy Application.
One Component, Electrically Conductive, Room Temperature Curing, Non-Corrosive Silicone for High Performance Bonding, Sealing and Coating with Carbon Filler.
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation. Magnificent Structural Adhesive Properties and Exceptional Thermal Cycling Capabilities.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Excellent Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability Along With Exceptional Electrical Insulation Properties.