Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.
One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 650°F.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.
One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.
Meets MIL-A-46146.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.
