One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.
Two Component, Silver Conductive Epoxy Adhesive for High Performance Bonding Featuring Rapid Set Up Time, Superior Bond Strength and Exceptionally Low Volume Resistivity Meets ISO 10993-5 for Cytotoxicity.
