Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
