One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.
Two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations..
One Component, Higher Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg
