One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance for Medical Device Manufacturing.
Two Component, Silver Conductive Epoxy Adhesive for High Performance Bonding Featuring Rapid Set Up Time, Superior Bond Strength and Exceptionally Low Volume Resistivity Meets ISO 10993-5 for Cytotoxicity.
One component, heat cured epoxy system for bonding, sealing, dam-and-fill applications. Resists temperatures up to +600°F. Thermally conductive, electrically insulating.
