One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.
One component die attach epoxy system with exceptionally high glass transition temperature. Resists temperatures up to +600°F. Thermally conductive, electrically insulating, Paste consistency.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.
